Daat Research launches thermal-modeling software for designs that keep circuit boards cool
Oct. 10, 2008
HANOVER, N.H. 10 Oct. 2008.Daat Research Corp. in Hanover, N.H., is introducing design software for printed circuit boards called CoolitPCB 4.0 that offers thermal modeling options to help engineers design circuit boards with thermal management in mind.
Users can build detailed models of ball grid arrays (BGAs), dual inline packages (DIPs), and quad flat packages (QFPs). Users also can choose integrated circuit (IC) packages, modify them and save the results.
CoolitPCB v4.0 enables PCB designers to do their own board level analysis, predict the thermal behavior of their designs, and pinpoint optimum component placement on their boards. For more information contact Daat Research online at www.daat.com.
