High-speed backplane connectors with 25-gigabit-per-second performance introduced by FCI

May 26, 2011
ETTERS, Pa., 26 May 2011. FCI in Etters, Pa., is introducing the XCede vertical backplane headers and right-angle daughter card receptacles for backplane databus applications that require performance of 25 gigabits per second. FCI is building the connectors as a licensed second source to Amphenol Corp. in Wallingford, Conn. FCI's XCede connectors provide two, four, or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module, FCI officials say.

ETTERS, Pa., 26 May 2011. FCI in Etters, Pa., is introducing the XCede vertical backplane headers and right-angle daughter card receptacles for backplane databus applications that require performance of 25 gigabits per second. FCI is building the connectors as a licensed second source to Amphenol Corp. in Wallingford, Conn.FCI's XCede connectors provide two, four, or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module, FCI officials say.The XCede connector can help systems designers migrate to new systems that need high-speed signaling, company officials say. Advanced engineering polymers in a resonance-damping shield helps eliminate crosstalk.

XCede connectors with six differential pairs per column fit 36-millimeter minimum card slot pitch and provide 82.4 differential signal pairs per inch. Four-pair connectors provide 54.9 signal pairs per inch and can be used down to 25-millimeter card slot pitch.

Guidance and power modules are included. Customized groupings of right-angle signal, guidance, and power modules can be attached to a wafer organizer to form a daughter card connector. Wide ground contacts in the vertical header feature a stiffening rib that extends near the tip of the contact for ruggedness and signal pin protection.

For more information contact FCI online at www.fciconnect.com/highspeed.

About the Author

John Keller | Editor

John Keller is editor-in-chief of Military & Aerospace Electronics magazine, which provides extensive coverage and analysis of enabling electronic and optoelectronic technologies in military, space, and commercial aviation applications. A member of the Military & Aerospace Electronics staff since the magazine's founding in 1989, Mr. Keller took over as chief editor in 1995.

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