Thermal-management electronics enclosure with drain for condensation introduced by EIC

Aug. 18, 2013
WARMINSTER, Pa., 18 Aug. 2013. EIC Solutions Inc. in Warminster, Pa., is introducing drip pans designed to manage condensation in embedded computing and other electronic subsystems by collecting moisture and then channeling it outside the enclosure via an external drain.

WARMINSTER, Pa., 18 Aug. 2013. EIC Solutions Inc. in Warminster, Pa., is introducing drip pans in refrigerated electronics enclosures designed to manage condensation in embedded computing and other electronic subsystems by collecting moisture and then channeling it outside the enclosure via an external drain.

To maintain electronics and other enclosure contents at safe operating levels, EIC thermal-management units lower the air temperature inside the cabinet, which can cause condensation. EIC's condensation-management design protects enclosure contents from water damage, rust, and corrosion.

EIC mounts thermoelectric cooling units in standard enclosures on the side panels. Specially contoured vertical drip pans are installed to capture condensation and channel it to a drain fitting in the bottom of the pan. A drain tube from the pan carries water out of the enclosure and away from electronics.

In cases where the cooling units are mounted on the top of enclosure, a horizontal drip pan with drain fitting is integrated into the air conditioner.

The drain tube opening is weatherproofed with rubber grommet and waterproof sealant. EIC offers alternatives such as a replaceable desiccant.

EIC electronic enclosures and transit cases protect controls, computers, cameras, telecom equipment and other electronics from particulate contaminants, oils, water, and most other environmental hazards.

For more information contact EIC online at www.eicsolutions.com.

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