Adhesive with low coefficient of expansion for aerospace uses introduced by Master Bond
HACKENSACK, N.J., 26 Jan. 2015. Master Bond Inc. in Hackensack, N.J., is introducing the EP42HT-2LTE two-component epoxy for a variety of bonding, sealing, coating and select casting applications in the electronics, aerospace, optical, and specialty OEM industries.
This adhesive has a flowable paste consistency that enables precise alignment with minimal fixturing, company officials say. It cures at room temperature, or more quickly with the addition of heat.
This adhesive has a low coefficient of expansion, and a tensile lap shear strength of more than 1,200 psi. It bonds well to a wide variety of similar and dissimilar substrates, including metals, composites, ceramics, glass, and many plastics.
The EP42HT-2LTE features superior electrical insulation properties, chemical resistance and dimensional stability over the wide service temperature range of -60 to 300 degrees Fahrenheit. It also offers low linear and volumetric shrinkage upon curing, which is useful for potting and encapsulation applications.
Featuring a light cream color, EP42HT-2LTE is prepared using a non-critical 100 to 40 mix ratio by weight or a 100 to 50 mix ratio by volume. After mixing a 100 gram batch, its working life is 60 to 90 minutes open time.
For more information contact Master Bond online at www.masterbond.com.
John Keller | Editor
John Keller is editor-in-chief of Military & Aerospace Electronics magazine, which provides extensive coverage and analysis of enabling electronic and optoelectronic technologies in military, space, and commercial aviation applications. A member of the Military & Aerospace Electronics staff since the magazine's founding in 1989, Mr. Keller took over as chief editor in 1995.
