Liquid electronics cooling for high-performance embedded computing offered by Mercury
Jan. 29, 2016
CHELMSFORD, Mass., 29 Jan. 2016. Mercury Systems Inc. in Chelmsford, Mass., is introducing the company's fluid management Liquid Flow-By electronics cooling technology for high-performance embedded computing (HPEC) subsystems to cool powerful and processing-dense devices.
Liquid Flow-By enables open-system architecture modules to operate unrestricted and reliably, regardless of the presence of a cooling air supply.
Liquid Flow-By integrates liquid cooling capability to remove about 50 percent more heat than other air-cooled approaches. Air and Liquid Flow-By have a technology readiness level of nine (TRL-9) to deliver double-sided cooling that complies to the rugged OpenVPX and AdvancedTCA architectures.
The cooling liquid may be the platform's own fuel supply which enters each module through non-drip, quick disconnects to complement or take over the native air cooling capability of each module. Non-drip technology makes each module and supporting chassis a self-sealing entity, which is critical for liquid cooled subsystems - especially when the coolant is fuel. In the absence of cooling air, the coolant takes over completely.
Related: Mercury combines Ethernet and OpenVPX for high-performance embedded computing
Air and Liquid Flow-By technologies remove heat such that systems can run at full speed, while increasing reliability by lowering the operating temperature of each processing device.
Mercury's open-systems Ensemble sensor chain building blocks enable complex processing subsystems to be quickly configured and are available as Air or Liquid Flow-By packages, or with conventional air and conduction-cooled options.
For more information contact Mercury Systems online at www.mrcy.com/cool.
