Microelectronics packaging for SWaP-constrained military embedded computing introduced by Mercury
ANDOVER, Mass. – Mercury Systems Inc. in Andover, Mass., is introducing the BuiltSECURE system-in-package (SiP) microelectronics packaging technology for high-performance, SWaP-constrained defense embedded computing" target='_blank'>embedded computing systems.
Combining the company's domain expertise in systems security engineering and 3-D microelectronics packaging, this packaging is for platform management systems, mission management systems, and command, control, and intelligence applications.
"Our BuiltSECURE SiP solutions are capable of providing the same security of long-lead application-specific integrated circuits (ASICs) at a fraction of the typical cost and schedule," says Scott Orton, vice president and general manager of Mercury's Trusted Mission Solutions group. "This is exactly what our customers are asking for in secure processing solutions."
Mercury's BuiltSECURE SiP technology addresses the most complex, multi-faceted challenges for the defense industry today with one, ruggedized ball grid array (BGA) package.
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It offers agile customization and accelerated time to market with rapid prototyping of microprocessors, field-programmable gate array (FPGA) devices, memory modules, sensor components, and security.
The technology also offers advanced thermal management through design tools that enable each device to dissipate more than 100 Watts of power.
Also included is embedded security through integrated secure boot capability through optional personalized security solutions to detect and mitigate adversarial non-invasive attacks. Also part of the package is trusted design and manufacturing in a DMEA-accredited facility protected by a vigilant cyber security program.
For more information contact Mercury Systems online at www.mrcy.com.
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