SOSA-aligned air- and conduction-cooled embedded computing chassis-management module introduced by Pixus

May 10, 2024
SOSA-aligned air- and conduction-cooled embedded computing chassis-management module introduced by Pixus

WATERLOO, Ontario – Pixus Technologies in Waterloo, Ontario, is introducing the SHM200 Tier 3 SOSA-aligned chassis-management module for OpenVPX that is pluggable.

The SHM200 chassis manager for OpenVPX complies to VITA 46.11 for system management. The unit comes in 3U and 6U sizes and in VITA 48.1 format for air cooled systems and VITA 48.2 format for conduction-cooled systems.

The Tier 3 embedded computing chassis manager can plug into a standard 3U VPX backplane slot in the P-zero connector position. There also are versions for more I/O that use the P1 or P1/P2 connectors. The standard panel interface has RS-232, RJ-45 or SFP, USB and LEDs.

With monitoring of at least six temperature sensors and 10 fans, the SHM200 has custom options available. There is fan PWM/Tach control, along with 16 digital inputs and outputs and a web interface.

Pixus offers OpenVPX backplanes, chassis platforms, and specialty products. The company also provides a mezzanine-based Tier 3 SOSA-aligned chassis manager that does not consume a slot. For more information contact Pixus Technologies online at https://pixustechnologies.com.

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