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Computers
ATLANT 3D
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TLANT 3D launches atomic-scale fabrication platform for materials and device development
The system uses ATLANT 3D's Direct Atomic Layer Processing (DALP) technology, which selectively deposits materials through a localized microreactor rather than applying a uniform...
Sept. 23, 2026
Curtiss-Wright
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Computers
Curtiss-Wright introduces rugged PacStar 810 edge server
Sept. 21, 2026
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ID 433441072 © BiancoBlue | Dreamstime.com
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Air Force taps DSD Laboratories for logistics IT, DevSecOps and agentic AI
Sept. 18, 2026
BAE Systems
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BAE Systems gets $16 million to reestablish rad-hard ASIC platform
Sept. 17, 2026
Molex
Size comparison of a VITA 90 VNX+ module and 3U VPX card, illustrating the VNX+ compact form factor.
Computers
Designing for the extreme edge: Engineering small-form-factor mission systems with VITA 90 VNX+
Sept. 15, 2026
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Sensors
How wearable RF sensors bring intelligence to the tactical edge
Sept. 14, 2026
U.S. Navy photo by Mass Communication Specialist 3rd Class Juan Cordova
An EA-18G Growler, attached to Electronics Attack Squadron (VAQ) 141, lands on the flight deck of Nimitz-class aircraft carrier USS George Washington (CVN 73) while underway in the Philippine Sea. U.S. Navy photo by Mass Communication Specialist 3rd Class Juan Cordova.
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General Dynamics wins $184 million Navy NGEAU production contract
Sept. 14, 2026
U.S. Air Force photo by Technical Sergeant Kekoa Santiago
U.S. Air Force Airmen assigned to the 452nd Logistics Readiness Squadron Aerial Port Flight at March Air Reserve Base, California, support loading operations of a next-generation nuclear reactor onto a C-17 Globemaster III. U.S. Air Force photo by Technical Sergeant Kekoa Santiago.
Power
Military electronics has a power problem
Sept. 10, 2026
Northrop Grumman
Northrop Grumman engineers manufacture new microchips cooled with diamond to help defense and commercial systems run faster and last longer. Northrop Grumman photo.
Power
Northrop Grumman advances diamond cooling for high-power RF electronics
Sept. 9, 2026
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