Start your computer development with Elma’s CompacFrame platform. Then easily move it to a rugged chassis like the new deployable CMOSS Modular Form Factor (CMFF) unit. Aligned to SOSA and SAVE-compliant, it is ideal for C5ISR applications in ground vehicles and avionics platforms. Meets MIL-STDs for harsh environments. Plug-in Cards (PICs) also available – see our website for payload options.

Holt’s dual channel radiation-hardened 3.3V MIL-STD-1553 transceiver is ideal for high reliability applications such as launch vehicles, high-altitude aircraft, low-orbit satellites and space. The HI-1592 is latch-up immune and proven to withstand a single-event upset (SEU) with an LET of at least 67.7 MeV-cm2/mg. The device is radiation tolerant to a total ionizing dose (TID) of 100 krad(Si).

The RMC3-160 is a feature rich 19″ rackmount chassis for 3U VPX and SOSA aligned payloads. Ideal for use in demanding environments across a range of applications. The system supports 48.2 modules with 40Gb / 100Gb backplanes options. This chassis includes high CFM cooling fans. The 4U low profile chassis has a hinged front panel that enables easy payload access and provides EMI protection.

WOLF’s VPX3U-AD5000E-CX7 module is ideal for data-heavy C5ISR and AI tasks. NVIDIA Ada GPUs use a 4N NVIDIA custom manufacturing process which provides denser GPUs with more CUDA and Tensor cores operating at higher clock frequencies, enabling significantly more performance. ConnectX^®-7 is ideal for fast, secure transfer of sensitive data, providing up to 100GbE and PCle Gen4 speeds.

Master Bond EP21NS is a two part adhesive system used for bonding, coating, sealing and potting/encapsulating. Its nanosilica filler imparts dimensional stability and abrasion resistance. This formulation is a reliable electrical insulator with a volume resistivity greater than 1015 ohm-cm. It is serviceable over the temperature range of -80°F to +250°F and bonds well to a variety of substrates.