Start your computer development with Elma’s CompacFrame platform. Then easily move it to a rugged chassis like the new deployable CMOSS Modular Form Factor (CMFF) unit. Aligned to SOSA and SAVE-compliant, it is ideal for C5ISR applications in ground vehicles and avionics platforms. Meets MIL-STDs for harsh environments. Plug-in Cards (PICs) also available – see our website for payload options.

As signal speed requirements reach toward 100Gb, LCR is committed to delivering backplane solutions that meet the highest levels of signal integrity in the industry. Our backplanes for VPX and SOSA aligned payloads are a trusted part of every system we provide and our experienced staff is ready to support your next mission requirements. Check out our backplane design capabilities brochure now.

The ODU AMC^® High-Density connector combines dual locking capabilities in a compact design. This innovative solution features both screw-locking and break-away functions, ensuring fast connection and added protection against vibration. It has a diameter of 10 mm to 15 mm and a contact density of up to 16 contacts. The series also supports power up to 15 A and high-speed data transfer.

WOLF’s VPX3U-AD5000E-CX7 module is ideal for data-heavy C5ISR and AI tasks. NVIDIA Ada GPUs use a 4N NVIDIA custom manufacturing process which provides denser GPUs with more CUDA and Tensor cores operating at higher clock frequencies, enabling significantly more performance. ConnectX^®-7 is ideal for fast, secure transfer of sensitive data, providing up to 100GbE and PCle Gen4 speeds.

Master Bond EP4NS-80 is a single component, low outgassing adhesive for bonding and sealing. It has reliable tensile strength as well as an exceptionally high tensile modulus. This system possesses good dimensional stability, low CTE and minimal shrinkage upon curing. EP4NS-80 is especially useful for laminating, impregnating, and underfill applications.