Commercial-Off-The-Shelf (COTS) rugged system featuring 13th Gen Intel^® Core™ i7 processor-based 3U VPX SBC hosting a Solid-State Drive (SSD) in one slot and a 12-port 10 Gigabit Ethernet switch and router in the second slot. The XChange6300 Cisco IOS-XE^® router XMC installed on the switch provides highly secure data, voice, and video communications to stationary and mobile network nodes.

Sensitron expanded their line of power modules to include the industry’s first high reliability SiC power module with an integrated gate drive utilizing power chip on board technology to create a high-power density design. This conduction cooled low weight (1.1 oz) and low profile (0.02 in) module simplifies implementation in high speed power switching environments. Contact us for a sample today!

Master Bond EP5TC-80 is a flowable paste epoxy for bonding, sealing and small encapsulation applications featuring electrical insulation and thermal conductivity. It contains filler materials with an ultra fine particle size, allowing it to achieve thermal conductivity values up to 3.3-3.7 W/(m•K). EP5TC-80 also meets NASA low outgassing specifications.