Provides design and manufacturing of 3-D and multi-chip modules, IC obsolescence and footprint adapters, miniaturized FPGA computing systems, FPGA processor boards, near-sensor image-processing solutions, and connectors.
ISI’s process of removing lead-free (RoHS) solder spheres then attaching leaded Sn63Pb37 eutectic spheres, has been audited and approved for production by several Tier 1 defense...
ISI is a leader in high density 3D memory packaging. Today’s solutions draw from our 25 year history in IC packaging and 19 issued patents relating to packaging technology.
ISI's 25+ years expertise in advanced packaging, manufacturing, and FPGA expertise allows us to deliver innovative miniature IC and miniature FPGA systems.
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