CSP optical failure analysis test sockets for EMMI or optical sensors introduced by Aries
BRISTOL, Pa., 25 June 2010. Aries Electronics in Bristol, Pa., is introducing a CSP test and measurement socket with a window that optically exposes 100 percent of the top of the device under test for failure analysis testing in emission microscopy or optical sensors applications.
Traditionally, a hole in the socket lid only exposes a maximum of 85 percent of the top of the device under test surface. Available with or without filters for UV, infrared, and full spectrum applications, the electro-optics test socket connectors be used for laser failure microscopy testing using laser signal injection microscopy techniques.
These failure techniques are efficient, non-invasive optical analysis tools used to detect and localize certain IC failures with maximum clarity and contrast. The techniques can be done from front or back.
The optical test socket line can accommodate quartz crystal, sapphire, and clear plastic window and lens materials. The window on the standard socket uses an optical quartz V077 glass with a 98 percent transmission rate from less than 260 nanometers in the near UV through to more than 2,000 nanometers in the infrared.
For more information contact Aries online at www.arieselec.com.
John Keller | Editor
John Keller is editor-in-chief of Military & Aerospace Electronics magazine, which provides extensive coverage and analysis of enabling electronic and optoelectronic technologies in military, space, and commercial aviation applications. A member of the Military & Aerospace Electronics staff since the magazine's founding in 1989, Mr. Keller took over as chief editor in 1995.
