112 gigabits per second connectors for uses like artificial intelligence (AI) introduced by Samtec

AcceleRate HP connectors deliver signal integrity and density, support data rates as fast as 112 gigabits per second PAM4 on a 0.635-millimeter pitch.
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Dec. 3, 2025
The Samtec 800-position APM6 and APF6 high-performance array connectors are for high-performance computing, artificial intelligence (AI), data storage, and networking.

Summary points:

  • Samtec introduces APM6 and APF6 high-performance array connectors for AI, HPC, networking, and data storage applications.
  • AcceleRate HP connectors support data rates up to 112 gigabits per second PAM4 with PCI Express 6.0, CXL 3.2, and 100-Gigabit Ethernet compatibility.
  • Features include 800-position configuration, 5-millimeter stack height, and IPC Class 3-compliant solder column termination for reliability.

NEW ALBANY, Ind. – Samtec Inc. in New Albany, Ind., is introducing the 800-position APM6 and APF6 high-performance array connectors for high-performance computing, artificial intelligence (AI), data storage, and networking.

The AcceleRate HP connectors deliver signal integrity and density, and support data rates as fast as 112 gigabits per second PAM4 on a 0.635-millimeter pitch.

Features include protocol compatibility with PCI Express 6.0, CXL 3.2, and 100 Gigabit Ethernet; 800-position configuration (8 rows × 100 positions) in a size of 68.62 by 18.20-millimeters; 5-millimeter mated stack height; 5-Ohm impedance; maximum two-amp current rating; and an pen pin field array design for grounding and routing.

The APM6 and APF6 connectors use Samtec's Solder column termination to enhance structural integrity. This IPC Class 3-compliant method is for dense, high-speed interconnects and offers solder joint reliability, insertion-loss, return-loss performance.

For more information, contact Samtec online at www.samtec.com/high-speed-board-to-board/high-density-arrays/accelerate-hp.

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