Liquid-cooled 6U VPX rugged embedded computing chassis for aerospace and defense uses introduced by Elma

Nov. 11, 2020
The chassis's backplane can move data as fast as 10 gigabits per second and can handle 300 Watts per slot to accommodate intense thermal management.

FREMONT, Calif. – Elma Electronic Inc. in Fremont, Calif., is introducing a rugged ATR chassis that complies with VITA 48.4 for liquid flow-through (LFT) cooling in a variety of aerospace and defense applications.

The chassis's backplane can move data as fast as 10 gigabits per second and can handle 300 Watts per slot to accommodate the intense thermal management necessary high-density embedded computing systems.

The liquid-cooled chassis also offers configurable front I/O connectors on a removable panel and a filtered power input connector. The chassis is one ATR tall with a rugged, bolted construction. Individual card coolant flow rates are adjustable with selectable orifices.

The backplane features eight 6U slots on a 1.2-inch pitch, including two VITA 62-compliant power supply slots, four 6U slots, and two 6U payload slots populated with J1-J6 connectors. Clockable guide pins are at each slot for easy keying.

Related: Liquid cooling for OpenVPX embedded computing development chassis introduced by Elma

The VITA 48.4 standard establishes the mechanical design, interface control, outline, and mounting requirements to ensure the mechanical intermateability of 6U VPX liquid-flow-through cooled plug-in modules within associated sub-racks.

The embedded computing standard enables more efficient cooling of circuit boards and electronic components via an integral heatsink with liquid flowing through it. The connector layout remains common with VITA 46 and quick disconnect coupling assemblies allow fluidic coupling to the chassis manifold.

For more information contact Elma Electronic online at www.elma.com.

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