Rugged XMC connector for improved signal processing on embedded computing introduced by TE Connectivity
HARRISBURG, Pa. – TE Connectivity in Harrisburg, Pa., is introducing the Mezalok High-Speed Low-Force (HSLF) XMC connector for improved signal processing on embedded computing applications.
These rugged, reliable connectors support data rate speeds as fast as 32 gigabits per second and are designed to meet the growing demand for high data rates in aerospace, ground vehicles, marine applications, and missile defense.
The enhanced HSLF Mezalok connector us designed specifically for mezzanine applications, and uses a rugged dual point contact system. The connectors meet the same rugged standards as VITA 47 and VITA 72. These HSLF connectors feature a wide operating temperature range and thermal stability with VITA 42.3 pinout.
The reliable Mezalok HSLF uses the ball grid array printed circuit board surface mount. The 114-position connector complies with VITA 61 standards and additional positions and stack heights are available.
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TE's Mezalok HSLF connector family offers unmating force reduction of 47 percent; mating force reduction of 32 percent; and a rugged dual-point contact system.
For product configurations, TE features multiple positions: 60, 114 and 320; multiple stack heights: 10, 12, 17 and 18 millimeters; and ball grid array circuit board supports come in standard surface mount processing.
For more information contact TE Connectivity online at www.te.com.
