Lead-free solder paste for uses that require extended thermal cycling performance offered by Indium Corp.
CLINTON, N.Y. – Indium Corp. in Clinton, N.Y., is introducing the Indium8.9HFRV air reflow no-clean solder flux vehicle to improve the voiding performance of next-generation lead-free high-reliability alloys.
Developed from the Indium8.9HF chemistry, the solder paste features low-voiding performance while providing stencil print transfer efficiency and response-to-pause performance.
Applications that require extended thermal cycling performance may use lead-free tin-silver-copper-based alloys that contain antimony, bismuth, and indium.
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Indium8.9HFRV is a for high-reliability alloys, and provides voiding performance and electrical and process reliability. The flux also is compatible with standard tin-silver-copper alloy systems.
Indium8.9HFRV offers low voiding when used with high-reliability alloys; high transfer efficiency through small apertures; excellent wetting; superior response-to-pause performance; and compatibility with Air and N2 reflow environments.
For more information contact Indium Corp. online at www.indium.com.
