Rugged Xeon D embedded computing modules with server-class performance introduced by Curtiss-Wright
May 18, 2015
ASHBURN, Va., 18 May 2015. The Curtiss-Wright Corp. Defense Solutions division in Ashburn, Va., is introducing the CHAMP-XDx Xeon D embedded computing family of rugged DSP engine modules based on the Intel Xeon processor D for compute-intensive C4ISR aerospace and defense applications.
The first members of the CHAMP-XDx embedded computing family, the 3U OpenVPX CHAMP-XD1 and 6U OpenVPX CHAMP-XD2, enable designers of high performance embedded computing (HPEC) systems to take advantage of the Intel Xeon processor D 3rd generation 64-bit system on chip (SoC) based on Xeon server-class processor technology.
These open-architecture COTS modules have high-speed DDR4 memory as well as high bandwidth PCI Express Gen 3 data paths on the data plane and the expansion plane. The board family makes it easy for systems designers to extend their applications across different platforms while maintaining their investment in software development.
These size, weight, power and cost (SWaP-C) optimized modules also have XMC card expansion and a combination of 1 Gigabit and 10 Gigabit Ethernet interfaces. The CHAMP-XDx module family is for the most demanding defense and aerospace rugged deployed HPEC systems, including next-generation radar, electronic warfare (EW), and C4ISR processing applications.
The CHAMP-XD1 and the CHAMP-XD2 will be available in a range of ruggedized configurations. The CHAMP-XD1 also provides PCI Express Gen 3 on the 3U Data Plane. The dual-processor CHAMP-XD2 brings the performance of two independent Xeon D processors to one 6U chassis slot. It supports either 40 Gigabit Ethernet or InfiniBand on the Data Plane in addition to its 1 Gigabit Ethernet and 10 Gigabit Ethernet interfaces.
For more information contact Curtiss-Wright Defense Solutions online at www.cwcdefense.com.