COM Express 3.0 embedded computing module for space-constrained applications introduced by ADLINK
SAN JOSE, Calif., 13 Sept. 2016. ADLINK Technology Inc. in San Jose, Calif., is introducing the COM Express 3.0-based Express-BD7 computer-on-module (COM) with Type 7 pinout for space-constrained embedded computing applications in industrial automation and data communications.
The Express-BD7 offers a server-grade platform and 10 Gigabit Ethernet capabilities to a COM form factor for virtualization, edge computing. or other numerical applications that require high density CPU cores balanced by reasonable power consumption.
The COM Express standard's Type 7 pinout, as compared to the Type 6 pinout, does away with all graphics support and replaces it with as many as four 10 Gigabit Ethernet ports and an additional eight PCI Express ports, bringing the total PCI Express support to as many as 32 PCI Express lanes.
The Type 7 pinout capitalizes on all the functions of low-power headless server-grade systems on chips (SoCs) with a TDP below 65 Watts. The Intel Xeon SoCs have in ADLINK's Express-BD7 support for as many as 16 CPU processor cores, 32 PCI Express lanes, and several 10 Gigabit Ethernet ports.
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ADLINK's Express-BD7 provides as much as 32 gigabytes dual channel DDR4 at 1867/2133/2400 MHz ECC (dependent on SoC SKU), as many as eight PCI Express x1 (Gen2), two PCI Express x4, one PCI Express x16 (Gen3), two SATA 6 gigabits per second and four USB 3.0/2.0.
The module comes with a build option for an extreme rugged operating temperature range of -40 to 85 degrees Celsius and supports ADLINK Smart Embedded Management Agent (SEMA), which enables remote management and control of distributed devices.
For more information contact ADLINK online at www.adlinktech.com.
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