COM Express module for small-form-factor embedded computing introduced by AAEON
Jan. 8, 2013
TAIPEI, Taiwan, 8 Jan. 2013. AAEON in Taipei, Taiwan, is introducing the NanoCOM-CV Rev.A COM Express Type 1 module for small-form-factorembedded computing designs in thermal-critical applications such as parking systems and home automation, or in compute-intensive applications for industrial automation, medical, and gaming.
A wide-temperature version for harsh environments is available on request.
The Com Express module has a low power BGA type Intel Atom N2600 1.6 GHz Dual Core processor. Complemented by the low-power Intel NM10 chipset, the NanoCOM-CV Rev.A module has wide temperature tolerance, company officials say.
The NanoCOM-CV Rev.A module measures 84 by 55 millimeters and packs 2 gigabytes of DDR3 memory onboard. Expansion interfaces include three PCI Express, one SMBus, and one LPC bus to connect to legacy I/O interfaces.
Eight USB 2.0 support, two SATA 3-gigabit-per-second interfaces with optional 4 gigabytes of SATA solid-state drive, one Gigabit Ethernet, one 18-bit single channel LVDS, and support of CRT/LCD simultaneous/dual view display, High Definition Audio and 8-bit programmable GPIO.
A matching MicroATX carrier board, the TF-ECB-916M-B11-01 is available for COM Express Type 1 modules on request. Software support includes Windows XP, Windows 7/8, and Linux Fedora.
For more information contact AAEON online at www.aaeon.com.
John Keller is editor-in-chief of Military & Aerospace Electronics magazine, which provides extensive coverage and analysis of enabling electronic and optoelectronic technologies in military, space, and commercial aviation applications. A member of the Military & Aerospace Electronics staff since the magazine's founding in 1989, Mr. Keller took over as chief editor in 1995.