ANDOVER, Mass. – Mercury Systems Inc. in Andover, Mass., is introducing a high-density secure memory device for space-constrained military and commercial avionics applications that require trusted computing.
Mercury's product embeds 2 gigabytes of double-data-rate third-generation synchronous dynamic random-access memory (DDR3 SDRAM) in a compact, ruggedized ball grid array (BGA) package.
The memory device is less than 2.4-millimeters in height to enable systems designers to mount high-speed, ruggedized memory on the backside of the printed circuit board instead of the front side.
Replacing four discrete memory devices on the front side of a board with one Mercury low-profile 2-gigabyte memory on the backside saves 441 square millimeters of front-side board real estate.
Mercury manufacturers these high-density secure memory products in the company's Defense Microelectronics Activity (DMEA)-trusted facility. Mercury protects its electronic records with an active cyber security program modeled after the Center for Internet Security (CIS) critical security controls.
For more information contact Mercury online at www.mrcy.com.
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