6U and 3U modular enclosures for rackmount embedded computing applications introduced by Pixus

WATERLOO, Ontario – Pixus Technologies in Waterloo, Ontario, is introducing modular subrack and enclosure configurations for rackmount embedded computing applications that require a mix of 6U and 3U circuit boards in the same enclosure.

The Pixus modular 19-inch rackmount enclosures have been used to enable designers to stack a second set of 3U boards above another row of 3U boards. The segmentation also allows the use of dual 3U segments.

The designs include versions in OpenVPX, CompactPCI, and custom backplane architectures. Pixus also offers specialized rugged rails for the high insertion forces of 6U OpenVPX.

The company also has applied the hybrid 3U/6U approach for horizontal-mount designs. For example, a 1U chassis can facilitate one each of the two board sizes.

Pixus provides subracks and electronics enclosures for various applications, including military and aerospace, industrial, energy, communications, medical, transportation, and research.

For more information contact Pixus Technologies online at www.pixustechnologies.com.

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