DARPA to brief industry on project to develop 3D chip optical interconnects to speed information throughput
ARLINGTON, Va. – U.S. military researchers will brief industry next month on a project to develop 3D chip-to-chip and intra-chip optical routing to speed information throughput and reduce vulnerability to electromagnetic interference.
Officials of the U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., will conduct industry briefings from 9 a.m. to 5 p.m. on 16 Sept. 2024 on the Heterogenous Adaptively Produced Photonic Interfaces (HAPPI) program. Briefings will be at the Executive Conference Center at 4075 Wilson Blvd., Suite 300, in Arlington, Va.
HAPPI will seek hardware demonstrations of low-loss, high-density optical interconnects using a scalable manufacturing process that is compatible with microelectronics.
The HAPPI program focuses on high-density 3D chip optical links and the ability to provide several routing planes within a photonic integrated circuit or photonic interposer.
The project also will emphasize vertical connections between routing layers that can traverse substrate thickness, and surface methods for coupling light from one photonic chip to another. Chip-to-fiber coupling and chip-to-chip edge coupling are not part of the program.
A major thrust of the program is to create optical interfaces that are robust to typical microsystem misalignments due to fabrication and assembly variability, especially for large link arrays that span reticle-or wafer-scale systems.
The program also will seek robust-by-design or adaptive interfaces capable of environmentally and mechanically stable optical performance, with compatibility with standard microelectronics manufacturing and assembly flows.
Approaches should include coupling to a photonic integrated circuit with demonstrated optoelectronic sources, amplifiers, modulators, multiplexers, filters, detectors, and other electro-optical components. The operating wavelengths may be within the visible or near infrared optical bands.
Companies interested should register no later than 9 Sept. 2024 online at https://web.cvent.com/event/c28d3f99-442a-47ea-b6ef-40e419eaf457/summary.
Email questions or concerns to DARPA's Anna Tauke-Pedretti at [email protected]. More information is online at https://sam.gov/opp/816bda822cb447bfabd1bf9ad6d86a60/view.
John Keller | Editor-in-Chief
John Keller is the Editor-in-Chief, Military & Aerospace Electronics Magazine--provides extensive coverage and analysis of enabling electronics and optoelectronic technologies in military, space and commercial aviation applications. John has been a member of the Military & Aerospace Electronics staff since 1989 and chief editor since 1995.
