Radiation-tolerant FPGAs for space applications from Microchip Technology achieve government QML Class V
CHANDLER, Ariz. – The radiation-tolerant RTG4 field-programmable gate arrays (FPGAs) with lead-free flip-chip bumps from Microchip Technology Inc. in Chandler, Ariz., have earned the Qualified Manufacturers List (QML) Class V status from the U.S. Defense Logistics Agency (DLA).
These radiation-tolerant FPGAs are for critical space programs. QML Class V is the highest level of qualification for space components for human-rated, deep-space, and national security space programs.
RTG4 FPGAs offer more than 150,000 logic elements, and come in flip-chip package construction where flip-chip bumps connect the silicon die and the package substrate for extended the longevity.
RTG4 FPGAs offer high density and performance to space applications, as well as low power consumption and immunity to configuration upsets. Programming technology of RTG4 FPGAs provides low static power for managing thermal issues common in spacecraft.
RTG4 FPGAs consume a fraction of the power of equivalent SRAM FPGAs, while exhibiting zero configuration upsets in radiation. The RTG4 FPGA has undergone extensive reliability testing, enduring as many as 2,000 thermal cycles at junction temperatures from 65 to 150 degrees Celsius.
The lead-free flip-chip bump interface connections meet MIL-PRF-38535, and show no signs of tin whiskers. The RTG4 FPGAs are supported by development kits, mechanical samples, and daisy chain packages for board validation and testing. The Libero SoC Design Suite enables RTL entry through programming and includes a rich IP library, complete reference designs and development kits.
For more information contact Microchip online at https://www.microchip.com/en-us/products/fpgas-and-plds/radiation-tolerant-fpgas/rtg4-radiation-tolerant-fpgas.
