New Multi-Protocol Avionics Module from GE Saves Power, Space, Weight and Cost

HUNTSVILLE, AL.—JANUARY 21, 2014—GE Intelligent Platforms today announced the RAR15-XMC-FIO High Density MIL-STD-1553 and ARINC 429 XMC Front I/O Module. A multi-protocol embeddable avionics module featuring front I/O, it is designed to save valuable space, weight and power, as well as deliver greater cost-effectiveness and higher reliability, as it delivers functionality that would previously have required the use of two XMCs. The RAR15-XMC-FIO will be used by a broad range of avionics organizations for simulation and testing as well as for deployment in embedded applications.