US based manufacturer of multilayer co-fired ceramic electronic packages (HTCC) and precision injection molded ceramics. AS9100D/ISO9001:2016 certified. Materials available include alumina and aluminum nitride.
With a high thermal conductivity of 160W/mK and thermal expansion of 4 x 10 -6/C, AlN is ideally suited for electronic packaging requiring good heat transfer.
KEY CONTACTS
Douglas Brown
Dir Sls/Mktg
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