XPedite8270

The XPedite8270 is a secure, high-performance, 3U VPX-REDI, single board computer aligned to the Sensor Open System Architecture (SOSA) standard.

Based on the 13th Gen Intel® Core™ i7 series (formerly Raptor Lake-P) line of processors, the XPedite8270 is an ideal choice for applications requiring maximum data and information protection along with high performance and power savings.

The XPedite8270 is a secure, high-performance, 3U VPX-REDI, single board computer aligned to the Sensor Open System Architecture (SOSA) standard. Based on the 13th Gen Intel® Core™ i7 series (formerly Raptor Lake-P) line of processors, the XPedite8270 is an ideal choice for applications requiring maximum data and information protection along with high performance and power savings.

The XPedite8270 integrates SecureCOTS™ technology with a Microsemi® PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.

The XPedite8270 provides fast and efficient I/O with one 40GBASE-KR4, two 10GBASE-KR, and one 10/100/1000BASE-T Ethernet ports. It supports 64 GB of LPDDR5 ECC SDRAM in addition to numerous I/O ports, including USB 2.0, PCI Express, RS-232 or RS-422/485 serial, and DisplayPort video through the backplane connectors. The XPedite8270 provides additional expansion capabilities by including an integrated XMC site. This XMC site includes a x4 PCI Express connection to the Intel® Core™ i7 processor and X12d, X16d, and X64s I/O mapped directly to the VPX backplane connectors.

Wind River VxWorks and X-ES Enterprise Linux (XEL) Board Support Packages (BSPs) are available.

FEATURES:

Supports 13th Gen Intel® Core™ i7 series (formerly Raptor Lake-P) processors
Designed with SecureCOTS™ technology to support enhanced security and trusted computing
Microsemi® PolarFire™ SoC FPGA with 256 MB SPI NOR flash
3U VPX (VITA 46) module
Compatible with multiple VITA 65 OpenVPX™ slot profiles
Ruggedized Enhanced Design Implementation (REDI) per VITA 48
64 GB of LPDDR5 ECC SDRAM
256 GB of UFS NAND flash
XMC site with x4 PCI Express interface and rear I/O support
One 40GBASE-KR4 Ethernet port
Two 10GBASE-KR Ethernet ports
One 10/100/1000BASE-T Ethernet port
One x4 Gen4 and one x2 Gen3 PCI Express interfaces
Two USB 2.0 ports
Two RS-232 serial ports or one RS-422/485 serial port
One DisplayPort interface
SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C-(E8)(P4F) (2E7-E3)(N-D1-U1-U1-M3/M4/M5-G1) <XA0> (compatibility with other profiles may be possible, contact factory for options)
Wind River VxWorks BSP
X-ES Enterprise Linux (XEL) BSP
Contact factory for availability of Microsoft Windows drivers and other operating systems

TECHNICAL SPECS:

Processor

Supports 13th Gen Intel® Core™ i7 series (formerly Raptor Lake-P) processors

Memory

64 GB of LPDDR5 ECC SDRAM
256 GB of UFS NAND flash
64 MB NOR boot flash
64 kB EEPROM

Security and Management

Microsemi® PolarFire™ SoC FPGA with 256 MB SPI NOR flash
Designed with SecureCOTS™ technology to support enhanced security and trusted computing
System voltage monitor, power-on/reset control, non-volatile write-protection control
Trusted Platform Module (TPM) 2.0
Tier 3 IPMI Controller (IPMC)

VPX (VITA 46) P0 I/O

Two IPMB connections to an IPMI Controller

VPX (VITA 46) P1 I/O

One 40GBASE-KR4 Ethernet port to P1.A
Two 10GBASE-KR Ethernet ports
One x4 PCI Express Gen4-capable interface
XMC X12d I/O
One maintenance serial port, software configurable to LVTTL or RS-232
One single-ended FPGA GPIO

VPX (VITA 46) P2 I/O

One 10/100/1000BASE-T Ethernet port
One DisplayPort HBR2-capable interface
One x2 PCI Express Gen3-capable interface
Two USB 2.0 ports
Two RS-232 serial ports or one RS-422/485 serial port
Three single-ended FPGA GPIOs
XMC X8d I/O
XMC X16s I/O

Software Support

UEFI firmware
Wind River VxWorks BSP
X-ES Enterprise Linux (XEL) BSP
Contact factory for availability of Microsoft Windows drivers and other operating systems

XMC Site

One x4 PCI Express Gen3-capable interface

Physical Characteristics

3U VPX-REDI conduction- or air-cooled form factor
SOSA-aligned to AMPS profile MODA3-16.2.15-1-F2C-(E8)(P4F)(2E7-E3) (N-D1-U1-U1-M3/M4/M5-G1)<XA0> (compatibility with other profiles may be possible, contact factory for options)
Dimensions: 100 mm x 160 mm
1.0 in. pitch with Two-Level Maintenance (2LM) support

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements

Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
Conformal coating available as an ordering option
Thermal performance will vary based on CPU frequency and application
Contact X-ES for air-cooled development options

Power Requirements

Power will vary based on configuration and usage. Please consult factory.

ACCESSORIES:

XIt1099 (90040110) - 3U VPX Rear Transition Module with 40 Gigabit and 10 Gigabit Ethernet, USB, Serial, and XIM Site
XTend4945 (90075025) - 3U VPX Development Backplane with RTM Support for XPand1007
XPand1007 (90075300) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O
XTend230 (90072690) - Debug Module for Programming and Diagnostic Interfaces

DOCUMENTATION: