ATR-5700 6-slot 3U VPX Rugged Air Cooled Enclosure

OpenVPX Ready Air Cooled Enclosure for deployed UAV or flight applications. A rugged solution typically found in expensive conduction-cooled platforms with the benefit of using inexpensive air-cooled boards, made possible by Dawn’s revolutionary Thermal Exchanged Flow™ (TEF) Cooling System.

The TEF uses a microcomputer-controlled two-stage cooling system consisting of a completely sealed inner housing and a forced air outer housing. The inner housing incorporates a high-velocity fan to move heat from the boards to the interior walls heat exchanger. Thermal energy passes through the walls to the external heat exchanger where it is removed by two high-CFM fans. 

• Ideal packaging solution for UAV or flight-deployed applications.
• Thermal Exchanged Flow (TEF™) Cooling System.
• Supports up to six 3U VPX air-cooled modules.

• Fully sealed internal electronics compartment.

• Integral 600-watt 6-channel VPX intelligent power supply.

• Embedded Dawn RuSH technology actively monitors system voltage, current, and temperature and talks over system management bus using I2C.

• Backplane topology and I/O is configurable at the time of order using Dawn-patented Fabric Mapping Modules (FMM).

• Available with optional shock isolated tray.

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