Bringing open hardware to the edge
Accelerate deployments with the interoperable, open standards-based CMS X08
Modern applications demand bleeding-edge silicon; users demand more processing, more bandwidth, and more capabilities. The Common Module System (CMS) X08 answers these demands through a modular, extensible, and open standards-based platform along with a standard board-to-module, module-to-rack, and rack-to-system interface.
Designed for networking, virtualization, big data, and signals intelligence workloads, Mercury's CMS X08 drives the world’s most critical applications.
- Accelerate development Rapidly test, prototype, and deploy IT infrastructure
- Eliminate complexity Create compute-, storage-, and network-optimized systems with common server elements
- Break vendor lock Expand supplier choice and future-proof your architecture through Open Compute Project (OCP) openEDGE
- Maximize density Shrink legacy rackmount deployments by 33% with half-width compute modules
- Crush bottlenecks Tackle spiraling data bandwidth requirements with modern protocols like 100-400 G Ethernet, PCI Express Gen 5.0, and Gen 5 NVMe
- Survive at the edge Bring data center capabilities to the field with the only OCP-based platform designed to MIL-STD-810H and MIL-STD-167-1
FEATURES
Technology and Options
- Lightweight 1U-3U chassis with 18" depth, fitting up to 6 compute-, storage-, or network-optimized blades
- Compatible with Open Compute Project (OCP) openEDGE ecosystem
- Supports a 4th Gen Intel® Xeon® Scalable processor (formerly Sapphire Rapids)
- Integrates a NVIDIA H100 GPU
- PCIe Gen 5.0 architecture
- Supports 100-400 Gb Ethernet, Gen 5 NVMe, DDR5
Testing and Manufacturing
- Designed and tested to military and industrial environmental standards
- Server designs and customer information protected by Mercury’s DFARS 252.204-7012- and NIST SP 800-171A-compliant IT infrastructure
- Designed, tested, and manufactured in AS5553-compliant, AS9100D- and ISO9001-certified U.S. facilities
SPECIFICATIONS
Module Mainboard
- Mercury Systems rugged motherboard
- Single socket E (LGA-4677)
- 4th Gen Intel® Xeon® Scalable processor
- 8 DIMM slots, 1 DPC, 4800 MT/s ECC DDR5
- Trusted Platform Module (TPM) 2.0
- Intel Virtual RAID on CPU (VROC)
Module Input/Output (I/O)
- (1) USB 3.1 Type A port (5 V/900 mA)
- (1) Mini display port (1920x1080)
- (1) IPMI port (RJ45)
- (1) Debug port (USB Mini-B)
Module OS Support
- Red Hat Enterprise Linux
- Windows Desktop & Server
- VMware ESXi
Module Management
- Redfish and IPMI 2.0 support
- Dedicated IPMI port
Chassis Management
- Dedicated RMC for multi-node control
- RMC may be excluded to airgap nodes
Chassis Form Factor
- 1U, 1-slot, 18" depth (CMS000-1U18F)
- 2U, 3-slot, 18" depth (CMS000-2U18F)
- 3U, 5-slot, 18" depth (CMS000-3U18F)
- Front I/O, front-to-back airflow
- Reverse airflow option available
Chassis Power
Option 1:
- 2400 W 120-240 VAC
- Dual redundant N+1 power supplies
- MIL-STD-461G, CE102, above and below deck
- MIL-STD-461G, RE102, below deck
Option 2:
- 2000 W - 48 VDC
- Dual redundant N+1 power supplies
Chassis Accessories
- 1U rail kit for 4-post threaded racks
- 2U/3U rail kit for 4-post threaded racks
- Rail kits are compatible with cabinets and transit cases up to 23" depth
Environmental (Operating)*
- Shock
- MIL-STD-810H
- Half sine pulse
- 30 G, 20 ms, 3 axis
- Vibration
- MIL-STD-167-1A
- Sinusoidal sweep and dwell
- 4-33 Hz
- MIL-STD-810H
- Random vibration
- 10-2000 Hz, 4.75 Grms
- MIL-STD-167-1A
- Altitude
- MIL-STD-810H
- 0-15,000 ft
- Temperature
- 0°C to 55°C at sea level
- Humidity
- MIL-STD-810H
- 5-95% RH, non-condensing
- Conformal coating available
Warranty
- Mercury Systems 3-year warranyExtended warranty available
See datasheets below for more details including module specifications
* Mercury Systems designs all products to meet or exceed listed data sheet specifications. Some specifications including I/O, weight, and thermal profiles are configuration dependent. Contact Mercury for information specific to your desired configuration requirements.
APPLICATIONS
- Artificial Intelligence (AI)
- Machine Learning (ML)
- Deep Learning (DL)
- Big Data Analytics
- High Performance Computing (HPC)
- 5G
- Virtualization
- Virtual Reality (VR)
- Image Processing
- Command, Control, Computers, Communications, Cyber, Intelligence, Surveillance, and Reconnaissance (C5ISR)
- Signals Intelligence (SIGINT)
- Sensor Fusion
- Industrial Automation