3U VPX XPedite7683 Offers the Intel® Xeon® D with 32 GB of -40° C-Manufacturer-Rated DDR4 Memory, Without Sacrificing XMC Support
Extreme Engineering Solutions (X-ES) rings in the new year by announcing the XPedite7683 embedded single board computer (SBC), a 3U VPX module based on the Intel® Xeon® D-1500 family of processors. In addition to its 12 Xeon®-class processing cores and XMC expansion site, the XPedite7683 includes 32 GB of single-die DDR4 memory with ECC, rated by the manufacturer to operate at temperatures down to -40°C. Compared to competitive 3U VPX options utilizing dual-die DDR4 memory devices that are rated only to 0°C by the manufacturer and need to be screened, the XPedite7683 offers significantly lower risk for programs that require reliable memory performance in all environmental conditions.
Reduced Risk from Components with Native Extended-Temperature Support
The XPedite7683 is the latest SBC from X-ES based on the Intel® Xeon® D-1500 (formerly Broadwell-DE) processor family, a micro-server class of processors optimized for compute-intensive embedded applications. The XPedite7683 enhances the capabilities of its predecessors by offering up to 32 GB of DDR4 ECC SDRAM, increasing the memory allocated to each Xeon® D processing core.
The XPedite7683 significantly reduces project risk by using memory components with native extended-temperature support, as opposed to commercial components that have been screened for extended temperatures. All components on the XPedite7683—including not only the DDR4 memory, but also the 12-core Xeon® D processor—are rated by the manufacturer for operating temperatures down to -40° C, providing unique assurance for environmentally challenging applications where long-term reliability is non-negotiable. Alternate processor configurations are available to accommodate a range of environmental, power, and performance requirements.
A Full-Featured, SWaP-Optimized Solution
Ideal for deployed systems with size, weight, and power (SWaP) constraints, the XPedite7683 delivers rich functionality in spite of its compact 3U format. Key features include an XMC expansion site with a x8 PCI Express Gen3-capable interface and a SATA interface, as well as two 10 Gigabit Ethernet ports and two Gigabit Ethernet ports. An onboard NAND flash module supplies up to 256 GB of storage with a Gen3-capable SATA interface and embedded DRAM for high-speed read/write capability.
An Open-Architecture Approach to Enhanced Security
With integrated SecureCOTS™ technology and an OpenVPX™-compliant design, the XPedite7683 is a flexible off-the-shelf solution that can help accelerate deployment for programs with stringent security requirements. The heart of the SecureCOTS™ technology is a Microsemi SmartFusion®2 SoC, which hosts custom functions to protect data from being manipulated, copied, or reverse-engineered. The Microsemi SmartFusion®2 SoC includes FPGA fabric with 86,316 logic elements, 1 GB of DDR3 ECC SDRAM, and 32 MB of SPI flash. It can control, intercept, and monitor the Xeon® D subsystem, implement penalties, and interface to the system through GPIO directly connected to the VPX backplane. The SecureCOTS™ design methodology also adds protection for the physical hardware with circuit board enhancements and optimized Two-Level Maintenance (2LM).
For applications that require secure storage, the XPort6105 secure Solid-State Drive (SSD) can be installed on the XPedite7683’s XMC site. The XPort6105 supports AES-256 XTS encryption and several military sanitization protocols, including a fast clear.
