First Level Inc

Provides die attach/ wire bonding Manufacturing Services specializing in miniaturization of Microelectronic Packaging & precision placement assembly of surface mount components. Applications include Solar (CPV), LED, Electronic Sensors,Optoelectronics, LCD, Microwave, Medical Devices, Light Engines, and Hybrid/Custom Modules. "Prototype to Production" Expertise in Flip Chip, Die Bonding, Wire