More Info on Six Sigma
More Info on Six Sigma
Offers backend semiconductor subcontract services: solder column attach, hot solder dipping, lead finish conversion (eutectic to lead-free and visa-versa), solderability testing, solderability failure analysis, solderability restoration, seal testing, BGA ball attach/reballing, and failure analysis, using SEM/EDS and XRF technologies.
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Request More Information From Six Sigma