CHANDLER, Ariz. – Microchip Technology Inc. in Chandler, Ariz., is introducing the aerospace-qualified BL1, BL2, and BL3 family of baseless power modules for new power-conversion technology in next-generation aircraft electrical systems.
The power modules are to enable higher-efficiency, lighter, and more compact power conversion and motor drive systems than are available today, company officials say.
Microchip developed these power modules together with Clean Sky, a joint European Commission (EC) and industry consortium. The modules are to help create more efficient aircraft electrical systems that replace today's pneumatics and hydraulics powering everything from on-board alternators to actuators and auxiliary power units (APUs).
The power modules provide greater efficiency in AC-to-DC and DC-to-AC power conversion and generation through the integration of silicon carbide power semiconductor technology.
Forty-percent lighter than others due to the modified substrate, the innovative design also produces an approximate 10 percent cost savings over standard power modules that incorporate metal baseplates.
Microchip's BL1, BL2, and BL3 devices meet RTCA DO-160G, and are available in low-profile, low-inductance packaging with power and signal connectors that designers can solder directly on printed circuit boards and connect or parallel in a three-phase bridge and other topologies.
The family incorporates silicon carbide metal oxide semiconductor field effect transistors (MOSFETs) and Schottky barrier diodes (SBDs) tor system efficiency.
The packages deliver 100 Watts to more than 10 kilowatts of power, and are available in phase leg, full bridge, asymmetric bridge, boost, buck, and dual common source. The power modules are available in voltage ranges from 600 to 1200 volts in silicon carbide MOSFETs and IGBTs to 1600 volts for rectifier diodes.
For more information contact Microchip Technology online at www.microchip.com.
