MUNICH – Infineon Technologies AG in Munich is introducing the SSO10T top-side cooling package for thermal management in metal oxide semiconductor field-effect transistors (MOSFETs) for electric power steering (EPS), EMB, power distribution, brushless DC drives (BLDC), safety switches, reverse battery, and DC-DC converters.
With its direct top-side electronics cooling, the package offers thermal performance by eliminating heat transfer into or through the circuit board of the automotive electronic control unit.
The package for MOSFETs enables a simple and compact double-sided circuit board design and minimizes cooling requirements and system costs for future automotive power designs.
The SSO10T TSC measures five by seven square millimeters, and is based on the SSO8 industry standard. The SSO10 TSC offers more than 20 percent and as much as 50 percent higher performance than the standard SSO8 – depending on the thermal interface (TIM) material used and the TIM thickness.
For more information contact Infineon Technologies online at www.infineon.com/cms/en/product/promopages/SSO10T.
