MUNICH – Infineon Technologies AG in Munich is introducing the TDM2354xD and TDM2354xT dual-phase power modules with power density sufficient for high-performance artificial intelligence (AI) data centers.
These power modules enable vertical power delivery (VPD) and offer current density of 1.6 amperes per square millimeter.
The TDM2354xD and TDM2354xT modules combine Infineon's OptiMOS 6 trench technology, a chip-embedded package that enables power density through enhanced electrical and thermal efficiencies, and a new inductor technology to enable low-profile vertical power delivery.
The TDM2354xT modules for data centers support as much as 160 amps and come in an 8-by-8-millimeter size. They offer extremely fast transient response and minimize on-board output capacitance by as much as 50 percent.
