High-reliability attenuator for RF and microwave applications in space introduced by Smiths Interconnect

June 29, 2021
The attenuation shift over temperature comes from using thick-film thermistor inks that are screen printed onto a ceramic substrate of aluminum oxide.

LONDON – Smiths Interconnect in London is introducing the SpaceNXT K2TVA thermopad temperature variable attenuator for gain compensation over temperature in critical space flight applications.

The high-reliability SpaceNXT K2TVA series offers a passive solution to offset signal strength fluctuation due to changes in temperature - an issue that affects all RF and microwave systems.

The attenuation shift over temperature comes from using thick-film thermistor inks that are screen printed onto a ceramic substrate of aluminum oxide.

"The SpaceNXT K2TVA Thermopad series is Smiths Interconnect's response to the increasing demand for high-reliability connectivity in commercial space programs, particularly GEO, MEO, and LEO satellites," says Tullio Panarello, vice president and general manager fiber optics and components at Smiths Interconnect.

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"Our reliable and durable SpaceNXT K2TVA Thermopad attenuators help customers reach higher frequencies in the face of congestion in broadcast spectrums for wireless communications and when in orbit for communication satellites," says Eric Lakin, the Smiths Interconnect vice president finance and strategy.

Each product is engineered using 3D electromagnetic simulation software to provide TCA targeting, and to help obtain the best attenuation flatness and voltage standing-wave ratio (VSWR) within the specified frequency band.

Designers can use the Thermopad in place of a standard chip attenuator to combine level setting or buffering and temperature compensation in a single chip design. This reduces the component count, whilst increasing reliability and lowering costs.

For more information contact Smiths Interconnect online at www.smithsinterconnect.com.

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