RF and microwave front end system-in-package for mixed-signal control introduced by Spectrum Control

MARLBOROUGH, Mass. – Spectrum Control in Marlborough, Mass., is introducing the RF+ SiP RF front end system-in-package for use as a co-processor to Direct RF FPGAs and mixed-signal control processor.

The RF+ SiP delivers a wideband RF front end in a 30-square millimeter ball grid array (BGA), and delivers the capabilities of an integrated microwave assembly in a surface-mount package. It also is for applications where size, weight, power consumption, and cost (SWaP-C) are a factor, such as smart antennas.

The RF+ SiP device addresses a defense industry need for high performance, cost-effective, miniaturized RF and microwave devices for affordable mass in mid-range precision-guided munitions.

Related: RF and microwave industry struggles to meet the high demands of the military

The RF front end offers a filtered range of 6 to 18 GHz and unfiltered range of 2 to 20 GHz with 2 GHz instantaneous bandwidth and full signal isolation, with no packaging-induced signal degradation.

It delivers gain of 15 decibels with a noise figure of 6 to 10 decibels, and includes an on-board FPGA for software-controllable signal conditioning, signal-level detection, self-tuning, on-chip power regulation and sensing, temperature sensing, and a standard digital control interface.

For more information contact Spectrum Control online at www.spectrumcontrol.com.