Military researchers approach industry for bonding single-crystal thin films for sensing and communications
ARLINGTON, Va. – U.S. military researchers are asking industry to find ways of bonding single-crystal thin-film multi-functional electro-optic, acousto-electric, acousto-optic, magneto-optic, or multi-ferroic materials for advanced sensing and communications applications.
Officials of the U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., issued a solicitation last Friday (DARPA-EA-25-02-04) for the Crystal Substrate Bonding Technologies and Algorithms (CRYSTAL) program.
Sensing and communications
Bonded single-crystal thin-film multi-function electro-optic, acousto-electric, acousto-optic, magneto-optic, or multi-ferroic materials are vital for diverse sensing and communications technologies for integrated quantum, photonic, terahertz, radio frequency, and actuator applications, researchers explain.
Wafer bonding onto compatible substrates is the critical step for integrating single-crystal thin films into multi-function devices and systems.
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Today there is no way to investigate wafer bonding analytically. Changes in materials or device parameters require significant trial and error, which is expensive and time-consuming.
CRYSTAL aims to investigate how to model bonding thin-film crystalline multi-function materials onto compatible substrates. The goal is to model wafer fabrication and bonding to capture interface properties and material-substrate compatibility, and predict the best wafer bonding conditions. Models will help discover, design, and fabricate bonded single-crystal thin-film material systems.
Areas of interest
Of interest are thin-film thickness, crystal orientation, surface preparation, oxide thickness, substrate material, wafer size, bonding temperature, bonding pressure, ion implantation dose, time, and gradients of temperature and pressure.
Companies interested should submit abstracts no later than 16 June 2025 to the DARPA BAA Tool online at https://baa.darpa.mil. Those submitting promising abstracts may be invited to give oral presentations.
Email questions or concerns to DARPA at [email protected]. More information is online at https://sam.gov/opp/d07df126129d4f98bd0a8d38aedf4218/view.
John Keller | Editor-in-Chief
John Keller is the Editor-in-Chief, Military & Aerospace Electronics Magazine--provides extensive coverage and analysis of enabling electronics and optoelectronic technologies in military, space and commercial aviation applications. John has been a member of the Military & Aerospace Electronics staff since 1989 and chief editor since 1995.
