Ball grid arrays (BGAs) are one of the most robust parts in electronic assembly. That said, defects can occur if stencil design, solder paste chemistry or reflow profile are not tightly controlled. Inspection can be challenging because solder joints are under the component. Defense and aerospace products have additional challenges in process management, as products continue to use leaded solder, creating scenarios where Pb-free BGAs and leaded (SnPb) solder mix. This whitepaper looks at issues that can create defects and best practices in inspection strategies to prevent defects from escaping the factory.
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