Innovation has driven a decrease in IR pixel pitch, enabling the potential reduction in size, weight, power, and cost (SWaP-C) of infrared (IR) thermal camera modules. This does not always apply to long-range IR systems. This paper examines the tradeoff analysis for a 5 µm, 8 µm, and 15 µm pixel pitch system where the impact of pixel pitch on SWaP-C and performance for both a continuous zoom (CZ) lens and the complete MWIR system is not straightforward.
This content is sponsored by:
