Small-form-factor embedded computing module for harsh-environment applications introduced by WinSystems
GRAND PRAIRIE, Texas – WinSystems Inc. in Grand Prairie, Texas, is introducing the COMeT10-3900 industrial COM Express Type 10 Mini embedded computing for industrial and other harsh-environment applications.
This low-power industrial small-form-factor module was designed and manufactured in the U.S., and is designed as a processor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements.
Suitable for industrial internet of things (IoT) applications, the COMeT10-3900 has an Intel Atom E3900 processor, formally Apollo Lake-I. It has as much as eight gigabytes LPDDR4 2400 MT/s system memory; Intel low-power Gen9 graphics engine; and full-HD and 3D graphics acceleration.
For trusted computing the module has on-board discrete TPM 2.0 hardware security. It operates in temperatures from -40 85 degrees Celsius, offers power input from 4.75 to volts to 20 volts DC.
Expansion includes four PCI Express lanes configurable as 4×1, 2×1 + 1×2, or 1×4; two USB 3.1 Gen 1, 6x USB 2.0; one MIPI-CSI-2 (4-Lanes); one i210 1-gigabit-per-second Ethernet RGMII with IEEE 1588 support; HD audio; two SATA III (6 -gigabit-per-second); two UART; and four GPI, four GPO (SDIO option for MicroSD socket).
The board for harsh-environment applications has on-board eMMC 5.x (eight to 128 gigabytes of on-board data storage; one dual-mode display (DisplayPort, HDMI, DVI); and one eDP (optional single-channel LVDS).
The module has custom-configurable UEFI based AMI BIOS; system management libraries and tools; EAPI v1.1 support for System Info, WDT, I2C, brightness, GPIO, and user storage area.
For more information contact WinSystems online at www.winsystems.com.
