Master Bond

Hackensack, NJ 07601

COMPANY OVERVIEW

About Master Bond

Master Bond custom formulates adhesives, sealants and coatings for structural bonding and electronic applications for aerospace and defense manufacturers, for over 45 years.

Product Summary

Master Bond’s wide-ranging product line of epoxies, silicones, UV curable and LED curable adhesives are reliable, come in convenient packaging and feature outstanding performance properties.

Contact

154 Hobart St
Hackensack, NJ 07601
United States
https://www.masterbond.com
201-343-8983
201-343-2132

More Info on Master Bond

Master Bond Logo 400x300b 605102ffc60b6

With a product line of over 3,000 formulations, Master Bond has been supplying aerospace and defense manufacturers with custom formulated compounds for structural bonding and a variety of electronic applications. Master Bond's mission is to develop cutting edge adhesives, sealants, coatings and potting/encapsulation systems utilizing advanced technology for challenging applications.

 High Performance Adhesives, Sealants & Coatings

Our expansive line of epoxies, silicones, UV curable and LED curable systems feature superior performance properties even in extreme conditions including:

  • High/low temperature resistance
  • Electrical conductivity/insulation
  • Thermal conductivity
  • High/low viscosity
  • Flexibility and toughness
  • Chemical resistance
  • Optical clarity

Our products feature superior long-term durability. They are used in a variety of industries and are designed to meet stringent industry standards and are certified for:

  • NASA low outgassing
  • Federal Aviation Regulations 25.853(a) for flame retardancy
  • UL 94V-0 and UL94V-1
  • UL 1203 for Explosion-Proof and Dust- Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations
  • U.S. MIL-STD 883J (Section 3.5.3) for thermal stability
  • U.S. MIL-STD 810G (Method 508.7) for fungus resistance.
  • Airbus testing for flame retardancy, smoke emission and toxicity
  • Boeing standards for low smoke and toxicity

Outstanding Customer Support

Master Bond makes customer support a fundamental priority in the adhesive selection process. Our technical specialists have decades of experience and will work with you, one-on-one, from the design, prototyping and manufacturing stages of your application.

Products

Courtesy of Master Bond
MasterSil 707FR-NV
Adhesives, encapsulants and bondings

MasterSil 707FR-NV

One component, room temperature curing, silicone elastomer
Ep21 Lvfl
Bonding and adhesives

EP21LVFL

Two component, low viscosity epoxy for bonding, sealing, coating, and potting featuring good flexibility
Ep40 Tc Med
Adhesives, encapsulants and bondings

EP40TCMed

Two component, thermally conductive, electrically insulative epoxy system for medical device applications
Supreme3 Dm 85
Adhesives, encapsulants and bondings

Supreme 3DM-85

One component, toughened epoxy system for bonding, sealing, and dam-and-fill encapsulation
Ep5 Lte 100
Adhesives, encapsulants and bondings

EP5LTE-100

One component epoxy for bonding and sealing featuring a low coefficient of thermal expansion and a curing temperature of 100°C
Ep17 Htda 2
Adhesives, encapsulants and bondings

EP17HTDA-2

One component die attach epoxy system with exceptionally high glass transition temperature
Ep41 S 5 Med
Adhesives, encapsulants and bondings

EP41S-5Med

Two component epoxy system featuring excellent resistance to sterilants, solvents and autoclaving
Supreme42 Ht 2 Nd Black
Bonding and adhesives

Supreme 42HT-2ND Black

Two component, non-flow epoxy system for bonding, sealing and coating
Ep5 Tc 80
Adhesives, encapsulants and bondings

Master Bond EP5TC-80 is a one component, flowable paste epoxy for bonding, sealing and small encapsulation applications

One component thermally conductive, electrically insulating epoxy with a curing temperature of 80 degrees Celsius

Press Releases

Image provided by Master Bond
Master Bond - Medical Grade, Dual Curable Adhesive
Bonding and adhesives

Medical Grade, Dual Curable Adhesive Offers Rapid Fixturing with LED Light

Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition...
Provided by Master Bond
EP53TC
Adhesives, encapsulants and bondings

Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing Specifications

Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The ...
Image provided by Master Bond
Toughened, Non-Drip Epoxy
Adhesives, encapsulants and bondings

Toughened, Non-Drip Epoxy Features High Glass Transition Temperature

Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. Supreme...

Videos

EP4S-80: One Part, Silver Filled Epoxy for EMI/RFI Shielding
Bonding and adhesives

EP4S-80: One Part, Silver Filled Epoxy for EMI/RFI Shielding

Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and...
6528265e7bb25.1011296921_c82df1460b6d972ce6c2f705c88369674460b4aa04f4abda75326b9f9e9ceb33_d_640
Adhesives, encapsulants and bondings

How Do You Use EP4EN-80 for Potting & Encapsulation Applications?

With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...
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Adhesives, encapsulants and bondings

About Master Bond

For over 40 years, Master Bond has been custom formulating advanced adhesive, sealing, coating, potting and encapsulation compounds for high tech industries.
Hqdefault 60510122b61e6
Adhesives, encapsulants and bondings

Product Spotlight: EP93FRHT

Specifically designed for avionic/aviation applications, Master Bond EP93FRHT readily passes the stringent Airbus specifications for vertical burn test, smoke emission and toxic...
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Adhesives, encapsulants and bondings

Webinar: How to Select the Right Adhesive for Aerospace Applications

Although there are many factors which can influence the selection process, the main focus of the discussion will be on the different cure mechanisms and the choice of fillers....

Resources

Image Provided by Master Bond
UV11-3
Adhesives, encapsulants and bondings

UV11-3: Used to create a self-written waveguide for f iber-to-lithium niobate chip coupling to reduce coupling losses

Overview of UV11-3 Master Bond UV11-3 is a hard, super-abrasion-resistant coating system for various substrates. It can be cured readily by ultraviolet (UV) exposure at around...
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EP30HT-LO
Adhesives, encapsulants and bondings

EP30HT-LO: Utilized by NASA to bond components in lunar exploration vehicles

Overview of EP30HT-LOMaster Bond EP30HT-LO is a moderate-viscosity, two-component, epoxy system that can be cured at room temperature, or at elevated temperatures for a faster...
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Master Bond UV10TKLO-2
Adhesives, encapsulants and bondings

UV10TKLO-2: Used to Adhere Mirrors in a Kirkpatrick-Baez Microscope to Image X-ray Emissions During Deuterium-Tritium Implosions

Overview Master Bond UV10TKLO-2 is a one-component UV-curable system for high-performance bonding, sealing, and encapsulation applications. It meets NASA’s specifications...

Articles

master_bond_2_oct_2024
Test

Two-part epoxy adhesive with acid resistance that acts as an electrical insulator introduced by Master Bond

The EP21ARHTND-2 also passes the damp heat reliability testing by withstanding 1000 hours of 85 degrees Celsius and 85 percent relative humidity.

Buyer’s Guide Listing Information

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Additional content from Master Bond

Image provided by Master Bond
EP21LSCL-2Med
Adhesives, encapsulants and bondings

Low Viscosity, Optically Clear Epoxy Passes ISO 10993-5 Standard

Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies...
Image provided by Master Bond
EP3HT-LO
Adhesives, encapsulants and bondings

One Part, Fast Curing Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP3HT-LO is a single component, non-premixed & frozen, heat cured epoxy, with an unlimited working life at room temperature. This system passes ASTM E595 tests...
Image Provided by Master Bond
Number of VHP Cycles
Bonding and adhesives

Master Bond’s Epoxy Compatibility with STERIS’s Vaporized Hydrogen Peroxide Sterilization Process

Master Bond and STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporized Hydrogen Peroxide (VHPTM) using V-PRO® s2 Low ...
Courtesy of Master Bond
Master Bond EP21ARHTND-2
Adhesives, encapsulants and bondings

Non-Drip Epoxy Features Acid Resistance

Non-Drip Epoxy Features Acid Resistance Master Bond EP21ARHTND-2 is a two-part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The...
Courtesy of Master Bond
Master Bond Supreme 11AOHTLP
Bonding and adhesives

Thermally Conductive Structural Epoxy Meets NASA Low Outgassing Specifications

Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts since...
Courtesy of Master Bond
Adhesives, encapsulants and bondings

One Component, Dual Cure Epoxy for Medical Applications

Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations ...
Courtesy of Master Bond
Adhesives, encapsulants and bondings

Two Part, Silver Filled Silicone Adhesive Meets NASA Low Outgassing Specifications

Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product...
Adhesives, encapsulants and bondings

Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity...
Adhesives, encapsulants and bondings

One Part Epoxy Changes from Red to Clear Under UV Light

Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light...
Adhesives, encapsulants and bondings

Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity

Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity...
Adhesives, encapsulants and bondings

Food Grade Epoxy Features Enhanced Chemical Resistance

EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. The epoxy...
Adhesives, encapsulants and bondings

Flexible, Thixotropic, One Component Dual Cure Epoxy

Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed...
Master Sil711 Med
Adhesives, encapsulants and bondings

One Part RTV Silicone Passes Non-Cytotoxicity Standards

Master Bond MasterSil 711Med is a one component, medical grade silicone adhesive that resists temperatures up to 400°F.
Ep21tdcs Lo 246
Bonding and adhesives

Case Study: EP21TDCS-LO: A Conductive Bonding Agent for Space-Environment Assemblies

Conductive bonding agents play a fundamental role in ensuring reliable electrical connectivity in many electromechanical assemblies designed to operate at the extremes of temperature...
Supreme17 Htnd 2
Adhesives, encapsulants and bondings

Toughened one-component epoxy features high-glass-transition temperature

Supreme 17HTND-2 cures at elevated temperatures with cure schedule options including 300°F for 4-6 hours or 350°F for 2-4 hours. An optimal cure schedule is at 300°F for 4-6 hours...
Ep21 Lvfl
Bonding and adhesives

Electrically insulative two-component epoxy features high elongation

Master Bond EP21LVFL combines good flexibility with a solid strength profile. It is curable at room temperature with a long working life of 120-160 minutes at 75°F for a 100 gram...
Ep40 Tc Med
Adhesives, encapsulants and bondings

Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications

Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically...
Supreme3 Dm 85
Adhesives, encapsulants and bondings

One Part, Toughened Epoxy for Dam-and-Fill Encapsulation

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill...
Ep5 Lte 100
Adhesives, encapsulants and bondings

Thixotropic Epoxy Features Low Coefficient of Thermal Expansion

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely...
Ep17 Htda 2
Adhesives, encapsulants and bondings

Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements

Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment.
Led415 Dc90
Adhesives, encapsulants and bondings

Dual Curable Adhesive Offers Rapid Fixturing with LED Light

Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure...
Ep41 S 5 Med
Adhesives, encapsulants and bondings

Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization

Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical ...
Supreme42 Ht 2 Nd Black
Bonding and adhesives

Electrically Insulative, Toughened Epoxy Meets NASA Low Outgassing Specifications

Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to...
Ep5 Tc 80
Adhesives, encapsulants and bondings

Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability

Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity...
Master Sil323 Ao Lo
Adhesives, encapsulants and bondings

MasterSil 323AO-LO

Two part thermally conductive, electrically insulating silicone for bonding and sealing
Master Sil323 Ao Lo
Adhesives, encapsulants and bondings

Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications

Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ...
Ep4 Cl 80 Med
Adhesives, encapsulants and bondings

EP4CL-80Med

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C for medical applications
Ep4 Cl 80 Med
Adhesives, encapsulants and bondings

Ultra-Low Viscosity, Biocompatible Epoxy Offers Optical Clarity

Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ...
Ep40 Nd
Adhesives, encapsulants and bondings

Toughened, Non-Drip Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio...
Ep17 Tf
Adhesives, encapsulants and bondings

EP17TF

One component, toughened epoxy system for bonding, sealing and coating
Ep17 Tf
Adhesives, encapsulants and bondings

Toughened One Part Epoxy Withstands Thermal Cycling

Master Bond EP17TF is a one part epoxy with a paste consistency, that can be readily dispensed evenly and uniformly. It has a moderately high glass transition temperature (Tg)...
Uv17 Med
Adhesives, encapsulants and bondings

UV17Med

UV system for high performance bonding, sealing and coating featuring superb adhesion to thermoplastic urethanes (TPUs)
Uv17 Med
Adhesives, encapsulants and bondings

Biocompatible UV Curable Adhesive Formulated for TPU Bonding

Master Bond UV17Med is a one part, no mix, UV curable system. It was specially formulated to provide excellent adhesion to many TPUs (thermoplastic polyurethanes), which are widely...
Master Sil 323
Bonding and adhesives

Flowable Silicone Offers Thermal Cycling and Shock Resistance

Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. This product has a convenient to use 1:1 mix ratio, and can ...
Ep4 G 80 Med
Adhesives, encapsulants and bondings

Low Viscosity, Electrically Conductive Epoxy Meets ISO 10993-5 Cytotoxicity Standards

Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to ...
Ep35 Aolv 0
Adhesives, encapsulants and bondings

Thermally Conductive Epoxy Features Chemical and High Temperature Resistance

Master Bond EP35AOLV is a two part heat cured epoxy system, designed for bonding, sealing, coating and potting applications.
Ep35 Aolv 0
Adhesives, encapsulants and bondings

EP35AOLV

Two component, thermally conductive, electrically isolating epoxy system for bonding, sealing and potting
Ep21 Ac Dsc5959
Adhesives, encapsulants and bondings

EP21AC

Two component epoxy system for encapsulating and coating that passes UL746A high amp arc ignition at 3.0 mm thickness with a PLC of 0
Ep21 Ac Dsc5959
Adhesives, encapsulants and bondings

UL Certified Epoxy Encapsulant Resists Arcing Without Igniting

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
Ep4 S 80
Bonding and adhesives

Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements.
Ep4 S 80
Bonding and adhesives

EP4S-80

One component, silver filled epoxy with a curing temperature of 80°C
Ep40 Tc
Bonding and adhesives

Thermally Conductive, Electrically Non-Conductive, Low Outgassing Epoxy

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.
Ep40 Tc
Bonding and adhesives

EP40TC

Two component, thermally conductive, electrically insulative epoxy system for bonding and sealing
Ep62 1 Ht Med
Adhesives, encapsulants and bondings

EP62-1HTMed

Two component, lower viscosity epoxy system featuring superior temperature and chemical resistance especially for repeated sterilization
Ep62 1 Ht Med
Adhesives, encapsulants and bondings

Non-Cytotoxic Epoxy Resists Sterilization by Autoclaving, Radiation and Chemicals

It features high temperature resistance, good flow properties and is suitable for bonding, sealing and coating.
Mb Wp Thumbnail Optically Clear Adhesives 200x260
Adhesives, encapsulants and bondings

Clearly Superior: Epoxies for Optical Applications

When determining the most effective adhesive to be used in opto-electronics, medical and other optic related industry applications, trade-offs of key characteristics should be...
Mb Wp Thumbnail Polymeric Systems Bring Clarity Optical Apps 200x262
Adhesives, encapsulants and bondings

Polymeric Systems Bring Clarity to Optical Applications

Whereas some optical assembly applications require optical clarity across a certain wavelength, others require an opaque coating. Optical grade epoxies, silicones and UV curable...
Mb Wp Thumbnail How Dual Curing Adhesives Uv Light Heat Improve Manufacturing 200x260 0
Adhesives, encapsulants and bondings

How Dual Curing Adhesives (UV Light + Heat) Improve Manufacturing

A dual cure adhesive has the UV light cure as the first step in the process, followed by a secondary thermal cure achievable at temperatures as low as 80°C.
Led405 Fl3
Bonding and adhesives

LED405FL3

One component, flexibilized LED curable system
Led405 Fl3
Bonding and adhesives

Flexible, Low Viscosity LED Curable Adhesive with a Fluorescent Dye

LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity and a refractive index of 1.51.
Ep5 G 80
Adhesives, encapsulants and bondings

EP5G-80

One Component, Graphite Filled Epoxy Features Electrical and Thermal Conductivity
Ep3 Hts Tc
Adhesives, encapsulants and bondings

EP3HTS-TC

Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy
Ep41 S 5 Nd Black
Adhesives, encapsulants and bondings

EP41S-5ND Black

Chemically Resistant, NASA Low Outgassing, Non-Drip Epoxy System
Ep30 4 Med
Adhesives, encapsulants and bondings

EP30-4Med

Two component, optically clear epoxy for medical device applications
Ep30 4 Med (1)
Adhesives, encapsulants and bondings

Optically Clear Epoxy Passes ISO 10993-5 Certification for Cytotoxicity

EP30-4Med is a two part epoxy system with a fast set up time that cures at room temperature, or even more rapidly with a bit of heat. This low viscosity system meets the requirements...
Master Sil153 Ao
Adhesives, encapsulants and bondings

MasterSil 153AO

Silicone Adhesive Features High Thermal Conductivity & Electrical Insulation
Supreme70 Cn
Adhesives, encapsulants and bondings

Supreme 70CN

Toughened NASA Low Outgassing Epoxy Derived from Sustainable Ingredients
Master Sil151 S (1)
Adhesives, encapsulants and bondings

Silver Conductive Silicone Adhesive Meets NASA Low Outgassing Specifications

Master Bond MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material.
Ep4 En 80
Adhesives, encapsulants and bondings

One Part Fast Curing Epoxy for Bonding and Small Encapsulation Applications

Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features...
Ep77 M F Med
Adhesives, encapsulants and bondings

EP77M-FMed

Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards
Ep51 Cc
Adhesives, encapsulants and bondings

EP51CC

Fast Setting, Two Component Epoxy Color Coded for Proper Mixing
Ep21 Ns
Adhesives, encapsulants and bondings

EP21NS

Nanosilica Filled, Electrically Insulative Epoxy Features Abrasion Resistance
Shared User Pra168ac2687e54d8ab2331b0b8f187736
Buyer's Guide

UV Curing Adhesive Passes NASA Low Outgassing Specifications

Master Bond UV10TK40M is a one part UV curable system, which is not oxygen inhibited, and can be used for bonding, sealing and coating applications.
Shared User Pr1ae5cdde506e493498db5ac35ccf1620
Adhesives, encapsulants and bondings

UV10TK40M

Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition...
Shared User Prbf58a7b3fb74403ba2c6787cb3c00e1f
Buyer's Guide

Toughened Epoxy Polysulfide Hybrid Offers Advanced Chemical Resistance

Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system.
Shared User Pr3de7ec27fbe84af388cd95306a16959d
Adhesives, encapsulants and bondings

EP21TP-2NV

Master Bond EP21TP-2NV is a two component epoxy polysulfide system formulated to cure at room temperature or more rapidly at elevated temperatures, with a one to one mix ratio...
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Buyer's Guide

Graphene Filled Epoxy Offers 5.5 W/(mK) Thermal Conductivity

It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability.
Shared User Pr5704c500bf3245de99baa4d2936f341e
Adhesives, encapsulants and bondings

Supreme 3CCM-85

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially designed for glob top...
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Buyer's Guide

Non-Premixed and Frozen, One Part Epoxy for Chip Coating

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially designed for glob ...
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Buyer's Guide

Optically Clear, Low Viscosity Epoxy System Features High Flexibility

Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use,...
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Adhesives, encapsulants and bondings

EP88FL

Two part epoxy, Master Bond EP88FL, is a low viscosity, optically clear system featuring good flexibility for high performance bonding, coating, sealing and potting. It is easy...
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Buyer's Guide

Toughened, Low Outgassing, One Component Epoxy Features Thermal Cycling Resistance

Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. “This ...
Shared User Pr0ca725b5b44046cfa1af3fc633a2e19f
Buyer's Guide

Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements

Product:  UV22DC80-1Med Release Date:  04/22/2019  Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism...
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Adhesives, encapsulants and bondings

EP30NG

Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity.
Shared User Usr98efa11650f7463fb5f3a37086c9e61c Mae
Buyer's Guide

Silver Conductive, One Component Epoxy Cures at 80°C

“While typical heat activated epoxies require 250°F to 350°F to cure, Supreme 3HTS-80 cures at 175°F to 185°F within 2-3 hours” says Rohit Ramnath,...
Shared User Precddd65e9a194d41ad4fd6ec49e118d4
Bonding and adhesives

Supreme 3HTS-80

One component, toughened, silver conductive epoxy system featuring good electrical conductivity and physical strength properties.
Shared User Pre37d0b4b68f949f494fb63729956aab8
Buyer's Guide

Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test

Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, Senior...
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Adhesives, encapsulants and bondings

EP93AOFR

Master Bond EP93AOFR is a two part, flame retardant epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. It fully complies...
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Buyer's Guide

Biocompatible, Nanosilica Filled LED Curable Adhesive

Master Bond LED405Med is a one component, LED curing adhesive system that meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. “Since this system...
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Buyer's Guide

Low Viscosity, Thermally Conductive Underfill Epoxy

Product:  EP3UF-1  Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable...
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Adhesives, encapsulants and bondings

EP3UF-1

Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. It is easily cured at elevated temperatures as low as 250°F. It is not premixed...
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Buyer's Guide

NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature

Master Bond UV26 is a new one part UV curable system featuring an exceptionally high glass transition temperature (Tg) ranging from 160 to 170°C. This NASA low outgassing ...
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Buyer's Guide

Two Part, Addition Cured Fluorosilicone Offers Excellent Chemical Resistance

Master Bond MasterSil 980 is two part fluorosilicone system for high performance bonding, sealing, coating and potting applications. It withstands harsh chemicals such as gasoline...
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Buyer's Guide

UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment

Product:  EP41S-6  Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard ...
Buyer's Guide

One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications

Product:  EP17HTND-CCM Release Date:  11/26/2018   Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient...
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Buyer's Guide

High Elongation, Two Component Epoxy System with Excellent Thermal Shock Resistance

Product:  EP110F8-3 Release Date:  09/05/2018   Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications...
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Buyer's Guide

High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial

It is a low viscosity formulation with a mixed viscosity of 2,500 to 5,000 cps. With a long working life of 60 to 90 minutes and a variety of curing options, the optimal cure ...
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Adhesives, encapsulants and bondings

MasterSil 980

Master Bond MasterSil 980 is a two component fluorosilicone for bonding, sealing, coating and encapsulating. Its most outstanding attribute is enhanced chemical resistance particularly...
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Adhesives, encapsulants and bondings

EP17HTND-CCM

Master Bond EP17HTND-CCM is a one part epoxy that is not premixed and frozen. This black, heat curable compound has a flowable paste consistency ideal for glob top, chip coating...
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Adhesives, encapsulants and bondings

UV26

UV26 is a one part UV curable system, featuring very low viscosity and high temperature resistance. This system provides excellent physical strength properties and superb chemical...
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Adhesives, encapsulants and bondings

EP41S-6

Master Bond EP41S-6 is a two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof...
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Adhesives, encapsulants and bondings

EP110F8-3

Master Bond EP110F8-3 is a two part epoxy system ideal for sealing, encapsulating, potting, and casting applications. “This toughened system provides very good flexibility and...
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Bonding and adhesives

EP21ND-LP

Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. It has an advantageously long working life of 2-4 hours at 75°F for a 100 ...
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Buyer's Guide

Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life

Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. It has an advantageously long working life of 2-4 hours at 75°F for a ...
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Buyer's Guide

Epoxy Features Very Low Coefficient of Thermal Expansion

Master Bond EP30LTE-2 is a highly dimensionally stable epoxy system with low linear and volumetric shrinkage upon curing. The compressive strength of the cured material is 24,...
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Adhesives, encapsulants and bondings

EP30LTE-2

Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating...
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Buyer's Guide

Toughened Two Part Epoxy Withstands Repeated Thermal Cycling

Product:  Supreme 62-1 Release Date:  06/04/2018   Master Bond Inc. has developed a solvent free, two component, toughened epoxy system called Supreme 62-1. It...
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Adhesives, encapsulants and bondings

Supreme 62-1

Supreme 62-1 has excellent physical strength properties and a glass transition temperature of 155-160°C. This two part epoxy delivers superior chemical resistance against acids...