Master Bond custom formulates adhesives, sealants and coatings for structural bonding and electronic applications for aerospace and defense manufacturers, for over 45 years.
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically...
Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition...
Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The ...
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. Supreme...
Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies...
Master Bond EP3HT-LO is a single component, non-premixed & frozen, heat cured epoxy, with an unlimited working life at room temperature. This system passes ASTM E595 tests...
Overview of UV11-3 Master Bond UV11-3 is a hard, super-abrasion-resistant coating system for various substrates. It can be cured readily by ultraviolet (UV) exposure at around...
Overview of EP30HT-LOMaster Bond EP30HT-LO is a moderate-viscosity, two-component, epoxy system that can be cured at room temperature, or at elevated temperatures for a faster...
Overview Master Bond UV10TKLO-2 is a one-component UV-curable system for high-performance bonding, sealing, and encapsulation applications. It meets NASA’s specifications...
Non-Drip Epoxy Features Acid Resistance Master Bond EP21ARHTND-2 is a two-part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The...
Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations ...
Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product...
Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity...
Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light...
Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity...
EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. The epoxy...
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed...
With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound...
Supreme 17HTND-2 cures at elevated temperatures with cure schedule options including 300°F for 4-6 hours or 350°F for 2-4 hours. An optimal cure schedule is at 300°F for 4-6 hours...
