Dual-cure adhesive for bonding medical and other high-reliability electronics introduced by Master Bond
HACKENSACK, N.J. – Master Bond Inc. in Hackensack, N.J., is introducing the LED415DC90Med one-component dual-cure adhesive for high-speed manufacturing of medical electronic devices and other high-reliability electronics.
It cures rapidly without oxygen inhibition on exposure to 405-nanometer LED light, followed by a short 30-to-45-minute heat cure at 90 to 95 degrees Celsius for bonding heat-sensitive components.
LED415DC90Med passes ISO 10993-5 requirements for non-cytotoxicity and resists common medical sterilants, including glutaraldehyde, peracetic acid, ethylene oxide, and gamma radiation.
LED415DC90Med can partially cure or fixture sections as deep as 6 millimeters when exposed to 405-nanometer LED light at the appropriate intensity and for a sufficient duration. This deeper-cure capability helps fixture opaque components by allowing light penetration through the adhesive from the sides. A subsequent cure at 90-to-100 C for 30 to 60 minutes helps optimize strength and overall performance.
Tensile strength
LED415DC90Med adhesive has a thixotropic index of 5.53 at room temperature. It exhibits a tensile strength of 5,500 to 6,500 pounds per square inch (PSI), a tensile modulus of 450,000 tp 550,000 PSI, and a lap shear strength exceeding 1,000 PSI (aluminum to aluminum).
This rigid system cures to a Shore D hardness of 85 to 90 with an elongation of 1 to 3 percent at 75 degrees Fahrenheit. It is serviceable from to 80 F to 350 F, electrically non to conductive, and bonds well to plastics, glass, and metals.
LED415DC90Med is available in syringes, half pint, pint, and quart containers. For more information contact Master Bond online at https://www.masterbond.com/tds/led415dc90med.
