• EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications.

    Request More Information

    By clicking above, I agree to Endeavor Business Media's Terms of Service and consent to receive promotional communications from Endeavor, its affiliates, and partners per its Privacy Notice. I also understand my personal information will be shared with the sponsor of this content, who may contact me about their offerings per their privacy policy. I can unsubscribe anytime.

    Latest in Adhesives, encapsulants and bondings

    Provided by YINCAE
    YINCAE
    Image provided by Master Bond
    Master Bond - Medical Grade, Dual Curable Adhesive
    Yincae Logo
    Provided by Master Bond
    EP53TC
    Image provided by Master Bond
    Toughened, Non-Drip Epoxy