Spring-loaded pins to deliver power for charging applications in a small form factor introduced by Mill-Max
OYSTER BAY, N.Y. – Mill-Max Mfg. Corp. in Oyster Bay, N.Y., is introducing spring-loaded pins that deliver high current-carrying capacity in a small form factor for charging applications and delivering power via cable or board-to-board interconnects.
These spring-loaded contacts are for docking stations, quick connects, blind mating applications, and board-to-board and cable connectors. The reduced size makes them suitable for low profile and dense packaging designs. The pins come in three different termination styles: surface mount, through-hole, and solder cup.
Pins are available in three different termination styles: surface mount, through-hole, and solder cup. They have a current-carrying capacity of six amps at 30 degrees Celsius of temperature rise, with an above-board height of 0.204 inches for the surface-mount and through- hole versions.
The solder cup version 0.374 inches long, and all have a maximum diameter of 0.083 inches. These design features result in low overall bulk resistance, efficient heat dissipation and electrical conductivity.
Other attributes include gold plating on all components; cycle life rating of 1,000,000 at half stroke; a maximum contact resistance of 20 micro-Ohms, and spring force of 60 grams at mid stroke.
For more information contact Mill-Max online at www.mill-max.com.
