Master Bond EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, EP21TDCS-LO has a one to one mix ratio by weight or volume. It readily develops a high bonding strength of more than 850 psi tensile shear and a T-peel strength of greater than 5 pli when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is less than 10-3 ohm-cm.
