Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect, and control...
X-band passive components for Space and DefenseMicrostrip Isolators, Circulators and Coaxial ComponentsSmiths Interconnect has launched its broad range of microstrip isolators...
Gel-Pak's vacuum release trays hold valuable devices in place and protect them during shipping handling and transport. Devices are off-loaded by applying vacuum to the under-side...
EMI O-rings and rubber extrusions are made with conductive, particle-filled elastomers for a variety of electronic applications. Fabritech, manufactures custom O-rings that will...
Our elastomer thermal pads fill the gaps between the heat generating components and heat dissipating surfaces (heatsinks) to maximize thermal dissipation, while forming an electrically...
Our EMI RFI shielding and traditional sealing technology, integrated with customer components, provides electrical conductivity between mating surfaces while ensuring environmental...
Our EMI RFI shielding and traditional sealing technology, integrated with customer components, provides electrical conductivity between mating surfaces while ensuring environmental...
Hermetically sealable high-temperature co-fired ceramic (HTCC) quad-flat-no-lead (QFN) packages, with air cavity, for high-frequency applications. The QFN packages are available...
AIT engineered several proven innovative lid-sealing solutions for optical, thermal, EMI and commercial component and module packaging with outanding cost effectiveness. It is...
AIT flexible film adhesives for die, component-substrate attach: Dry and tacky pressure sensitive epoxy film adhesives; thermally conductive insulating film and paste adhesives...
Hermetic electronic packaging custom manufactured to meet a variety of engineering challenges including: CTE, thermal conductivity weight and footprint restrictions.
